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HPSP Co., Ltd. 403870.KQ · Stock Open HPSP Co., Ltd. in new tab

46600.00 KRW
Yield
1.03%
ROE
30.51
Beta
1.60
Target Price
59714.29 KRW
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Key Metrics
Earnings dateAug. 19, 2026
Debt/Equity0.74
% Insiders45.635%
Growth
Revenue Growth-0.13%
Earnings Growth0.63%
Estimates
Forward P/E31.13
Target Mean Price59714.29
Dividend
Dividend Yield1.03%
Annual dividends600.00 KRW
Ex-Div. DateDec. 29, 2025
Payout49.41%

DCF Valuation

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Currency: KRW
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DCF Result

Fair Value (DCF)
Current Price
Upside
WACC
Terminal PV
Σ PV of FCFs
Note: historical bars show reported FCF (for context); forward bars show PV of projected FCF; if no per-year data, totals are shown.

HPSP Co., Ltd. Logo HPSP Co., Ltd. Analysis (403870.KQ)

South Korea Technology Official Website Stock

Is HPSP Co., Ltd. a good investment? HPSP Co., Ltd. (403870.KQ) is currently trading at 46600.00 KRW. Market analysts have a consensus price target of 59714.29 KRW. This suggests a potential upside from current levels.

Earnings Schedule: HPSP Co., Ltd. is expected to release its next earnings report on Aug. 19, 2026.

For income investors, HPSP Co., Ltd. pays a dividend yield of 1.03%. With a payout ratio of 49%, the dividend appears sustainable.

Investor FAQ

Does HPSP Co., Ltd. pay a dividend?

Yes, it pays an annual dividend of 600.00 KRW (1.03% yield).

What asset class is HPSP Co., Ltd.?

HPSP Co., Ltd. is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be Aug. 19, 2026.

Company Profile

HPSP Co., Ltd. manufactures and sells high pressure annealing semiconductor equipment for the semiconductor industry in South Korea. It offers GENI-SYS, a high-pressure hydrogen annealing equipment; and GENI and GENI-SE. The company also provides after-sales service for products; and sells parts. HPSP Co., Ltd. was founded in 2005 and is headquartered in Hwaseong-si, South Korea.

Exchange Ticker
KOE 403870.KQ
Trades
Dividend Yield
1.03%
Annual Dividends
600.00KRW
Next Ex. Div Date
Dec. 29, 2025
Payout Ratio
49.41%
Dividend History paid per year (KRW)
Historical Dividends
Year Total Dividends
2027
500.00 KRW
April 12, 2027 (estimated) 500.0000
2026
500.00 KRW
April 10, 2026 500.0000
2024
637.50 KRW
Dec. 27, 2024 600.0000
April 25, 2024 37.5000
2023
600.00 KRW
April 27, 2023 600.0000
Upcoming Dividends
Name Payment Date Status Amount
HPSP Co., Ltd. Apr 10, 2026 500.0 KRW
Stock Splits
Split Date Split Ratio to 1
March 16, 2023 4.000000
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