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TOWA Corporation 6315.T · Stock Open TOWA Corporation in new tab

3165.00 JPY
P/E
54.29
EPS
61.24
Yield
0.68%
P/B
3.53
ROE
6.96
Beta
1.32
Target Price
3425.00 JPY
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Key Metrics
Earnings dateAug. 6, 2026
P/E54.29
EPS61.24
Book Value941.13
Price to Book3.53
Debt/Equity25.73
% Insiders16.818%
Growth
Revenue Growth0.23%
Earnings Growth-0.34%
Estimates
Forward P/E17.21
Forward EPS193.18
Target Mean Price3425.00
Dividend
Dividend Yield0.68%
Annual dividends24.00 JPY
Ex-Div. DateMarch 30, 2027
Payout32.67%
5y avg Yield1.21%

DCF Valuation

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DCF Result

Fair Value (DCF)
Current Price
Upside
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Terminal PV
Σ PV of FCFs
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TOWA Corporation Logo TOWA Corporation Analysis (6315.T)

Japan Information Technology Official Website Stock

Is TOWA Corporation a good investment? TOWA Corporation (6315.T) is currently trading at 3165.00 JPY. Market analysts have a consensus price target of 3425.00 JPY. This suggests a potential upside from current levels.

In terms of valuation, the stock trades at a P/E ratio of 54.29. This high multiple suggests investors have priced in significant future growth expectations.

Earnings Schedule: TOWA Corporation is expected to release its next earnings report on Aug. 6, 2026. The market consensus estimate for Forward EPS is 193.18.

For income investors, TOWA Corporation pays a dividend yield of 0.68%. With a payout ratio of 33%, the dividend appears sustainable.

Investor FAQ

Does TOWA Corporation pay a dividend?

Yes, it pays an annual dividend of 24.00 JPY (0.68% yield).

What asset class is TOWA Corporation?

TOWA Corporation is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be Aug. 6, 2026. The company currently has a trailing EPS of 61.24.

Company Profile

TOWA Corporation engages in the design, development, manufacture, and sale of semiconductor manufacturing equipment and high-precision molds in Japan and internationally. It operates through three segments: Semiconductor Manufacturing Equipment, Medical Device, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment manufactures and sells precision molds for semiconductor manufacturing, molding equipment, singulation equipment, etc.; and provides after–sale services. The Medical Device segment manufactures and sells medical devices and other products. The Laser Processing Equipment segment is engaged in the manufacture and sale of laser processing equipment and provision of after–sale services. Its products also include precision molds, end mills and drill series, TEN-systems, and mold release films. The company was formerly known as TOWA Precision Industries Limited and changed its name to TOWA Corporation in December 1988. TOWA Corporation was incorporated in 1979 and is headquartered in Kyoto, Japan.

Exchange Ticker
JPX (Japan) 6315.T
Trades
Dividend Yield
0.68%
5y avg 1.21%
Annual Dividends
24.00JPY
Next Ex. Div Date
March 30, 2027
Payout Ratio
32.67%
Dividend History paid per year (JPY)
Historical Dividends
Year Total Dividends
2027
24.00 JPY
March 30, 2027 24.0000
2026
20.00 JPY
June 5, 2026 20.0000
2025
20.00 JPY
June 6, 2025 20.0000
2024
40.00 JPY
June 6, 2024 40.0000
2023
40.00 JPY
June 8, 2023 40.0000
2022
51.00 JPY
June 30, 2022 51.0000
2021
16.00 JPY
June 30, 2021 16.0000
2020
16.00 JPY
June 29, 2020 16.0000
2019
16.00 JPY
June 28, 2019 16.0000
2018
16.00 JPY
June 29, 2018 16.0000
Upcoming Dividends
Name Payment Date Status Amount
TOWA Corporation Mar 30, 2027 Upcoming 24.0 JPY
TOWA Corporation Jun 05, 2026 20.0 JPY
Stock Splits
Split Date Split Ratio to 1
Sept. 27, 2024 3.000000
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