Lasertec Corporation 6920.T Open Lasertec Corporation in new tab
Lasertec Corporation Analysis (6920.T)
Is Lasertec Corporation a good investment? Lasertec Corporation (6920.T) is currently trading at 38380.00 JPY. Market analysts have a consensus price target of 39260.00 JPY. This suggests a potential upside from current levels.
In terms of valuation, the stock trades at a P/E ratio of 39.68. This high multiple suggests investors have priced in significant future growth expectations.
Earnings Schedule: Lasertec Corporation is expected to release its next earnings report on Aug. 12, 2026. The market consensus estimate for Forward EPS is 1092.17.
For income investors, Lasertec Corporation pays a dividend yield of 0.82%. With a payout ratio of 36%, the dividend appears sustainable.
Investor FAQ
Does Lasertec Corporation pay a dividend?
Yes, it pays an annual dividend of 329.00 JPY (0.82% yield).
What asset class is Lasertec Corporation?
Lasertec Corporation is classified as a Stock. You can compare it against 2 other assets in the "Related Symbols" list on this page.
When is the next earnings date?
The next earnings date is projected to be Aug. 12, 2026. The company currently has a trailing EPS of 967.13.
Company Profile
Lasertec Corporation engages in the design, manufacture, and sale of inspection and measurement equipment in Japan, South Korea, Taiwan, Other Asia, the United States. The company offers semiconductor related products, including Actinic EUV patterned mask inspection system, EUV mask blanks inspection and review system, mask inspection system, mask blanks inspection and review system, EUV pellicle inspection system, EUV mask backside inspection and cleaning system, and mask edge inspection system; phase-shift and transmittance measurement system, phase-shift measurement system; SiC wafer inspection and review system, GaN wafer inspection and review system, high sensitivity under-layer defect inspection and review system, multi-wavelength wafer inspection system, high sensitivity wafer edge inspection system, wafer edge-dimension measurement system, via depth measurement system, TSV back grinding process measurement system, and fully automated wafer measurement system. It also provides FPD photomask inspection system, pellicle inspection and pellicle mounting system for CLIOS, and FPD mask blanks inspection system; and microscopes, such as laser microscopes, electro-chemical reaction visualizing confocal system, and in-situ observation at ultra high temperature confocal scanning laser microscope. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.
Dividend Yield
0.82% (5y avg: 0.84%)
Annual Dividends
329.00 JPY
Next ex. div date
June 29, 2026
Payout Ratio
35.81%
Historical Dividends
| Year | Total Dividends |
|---|---|
| 2027 | 195.33 JPY |
| March 8, 2027 (estimated) | 195.3326 |
| 2026 | 327.00 JPY |
| Sept. 29, 2026 | 195.0000 |
| March 12, 2026 | 132.0000 |
| 2025 | 329.00 JPY |
| Sept. 29, 2025 | 214.0000 |
| March 7, 2025 | 115.0000 |
| 2024 | 230.00 JPY |
| Sept. 27, 2024 | 157.0000 |
| March 6, 2024 | 73.0000 |
| 2023 | 180.00 JPY |
| Sept. 28, 2023 | 128.0000 |
| March 8, 2023 | 52.0000 |
| 2022 | 82.00 JPY |
| Sept. 29, 2022 | 50.0000 |
| March 4, 2022 | 32.0000 |
| 2021 | 55.00 JPY |
| Sept. 29, 2021 | 35.0000 |
| March 5, 2021 | 20.0000 |
| 2020 | 42.50 JPY |
| Sept. 29, 2020 | 27.0000 |
| March 6, 2020 | 15.5000 |
| 2019 | 47.00 JPY |
| Sept. 30, 2019 | 31.0000 |
| March 6, 2019 | 16.0000 |
| 2018 | 34.00 JPY |
| Sept. 27, 2018 | 22.0000 |
| March 5, 2018 | 12.0000 |
| 2017 | 28.00 JPY |
| Sept. 28, 2017 | 28.0000 |
| 2016 | 51.00 JPY |
| June 28, 2016 | 51.0000 |
| 2015 | 46.00 JPY |
| June 26, 2015 | 46.0000 |
| 2014 | 27.00 JPY |
| June 26, 2014 | 27.0000 |
| 2013 | 48.00 JPY |
| June 26, 2013 | 48.0000 |
| 2012 | 53.00 JPY |
| June 27, 2012 | 53.0000 |
| 2011 | 41.00 JPY |
| June 28, 2011 | 41.0000 |
| 2010 | 15.00 JPY |
| June 28, 2010 | 15.0000 |
Yearly aggregated dividends
Dividends
|
Lasertec Corporation
Sep 29, 2026 Upcoming
Dividend
195.0 JPY |
|
Lasertec Corporation
Mar 12, 2026 Paid
Dividend
132.0 JPY |
|
Lasertec Corporation
Sep 29, 2025 Paid
Dividend
214.0 JPY |
Historical Split Corporate Actions
| Split Date | Split Ratio to 1 |
|---|---|
| June 26, 2013 | 2.000000 |
| March 29, 2017 | 2.000000 |
| Dec. 27, 2019 | 2.000000 |
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