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 Logo Amkor Technology, Inc. - AMKR 20.39 USD

P/E
20.37
EPS
1.52
Yield
3.98%
P/B
1.88
ROE
9.67
Beta
1.85
Target Price
40.50 USD

20.390 USD

20.390 USD

Daily: +1.34%
Key Metrics

Earnings date: May 29, 2024

P/E: 20.37

EPS: 1.52

Book Value: 16.44

Price to Book: 1.88

Debt/Equity: 32.22

% Insiders: 55.543%

Growth

Revenue Growth: 0.00%

Earnings Growth: 0.04%

Estimates

Forward P/E: 13.01

Forward EPS: 2.38

Target Mean Price: 40.50

Dividend

Dividend Yield: 3.98%

Annual dividends: 0.73 USD

Ex-Div. Date: June 5, 2025

Payout: 50.35%

 Logo About Amkor Technology, Inc. - (AMKR)

Country: United States

Sector: Information Technology

Website: http://amkor.com

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.

Exchange Ticker
NMS (United States) AMKR
FRA (Germany) AMK.F
Dividend Yield

3.98%

Annual Dividends

0.73 USD

Next ex. div date

June 5, 2025

Payout Ratio

50.35%

Historical Dividends
Year Total Dividends
2026 0.08 USD
2025 0.90 USD
2024 0.72 USD
2023 0.30 USD
2022 0.22 USD
2021 0.21 USD

Yearly aggregated dividends

Dividends

Amkor Technology, Inc.
Jun 25, 2025 Upcoming
Dividend
0.0827 USD
Amkor Technology, Inc.
Apr 02, 2025 Paid
Dividend
0.083 USD
Amkor Technology, Inc.
Dec 23, 2024 Paid
Dividend
0.488 USD
Amkor Technology, Inc.
Sep 23, 2024 Paid
Dividend
0.079 USD

Historical Split Corporate Actions

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