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Techbond Group Berhad 5289.KL · Stock Open Techbond Group Berhad in new tab

0.2950 MYR
P/E
9.67
EPS
0.03
Yield
6.03%
P/B
0.81
ROE
7.21
Beta
0.11
Target Price
0.36 MYR
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Key Metrics
Earnings dateNov. 25, 2026
P/E9.67
EPS0.03
Book Value0.36
Price to Book0.81
Debt/Equity4.60
% Insiders73.924%
Growth
Revenue Growth-0.04%
Earnings Growth0.69%
Estimates
Forward P/E9.51
Forward EPS0.03
Target Mean Price0.36
Dividend
Dividend Yield6.03%
Annual dividends0.01 MYR
Ex-Div. DateDec. 5, 2025
Payout29.76%

DCF Valuation

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DCF Result

Fair Value (DCF)
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Note: historical bars show reported FCF (for context); forward bars show PV of projected FCF; if no per-year data, totals are shown.

Techbond Group Berhad Logo Techbond Group Berhad Analysis (5289.KL)

Malaysia Basic Materials Official Website Stock

Is Techbond Group Berhad a good investment? Techbond Group Berhad (5289.KL) is currently trading at 0.2950 MYR. Market analysts have a consensus price target of 0.36 MYR. This suggests a potential upside from current levels.

In terms of valuation, the stock trades at a P/E ratio of 9.67. This relatively low multiple may signal that Techbond Group Berhad is undervalued compared to historical market norms.

Earnings Schedule: Techbond Group Berhad is expected to release its next earnings report on Nov. 25, 2026. The market consensus estimate for Forward EPS is 0.03.

For income investors, Techbond Group Berhad pays a dividend yield of 6.03%. With a payout ratio of 30%, the dividend appears sustainable.

Investor FAQ

Does Techbond Group Berhad pay a dividend?

Yes, it pays an annual dividend of 0.01 MYR (6.03% yield).

What asset class is Techbond Group Berhad?

Techbond Group Berhad is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be Nov. 25, 2026. The company currently has a trailing EPS of 0.03.

Company Profile

Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, Thailand, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based, solvent-based, and modified hybrid sealants. It also provides supporting products and services, including customized industrial adhesives and sealants for original equipment manufacturers, adhesive maintenance products comprising repellents and cleaners, and adhesive blending machines. In addition, the company offers specialty chemicals, such as wood adhesives, formalin, phenolic resins, dry strength resins, microspheres, and specialty resins serving industries that includes aerospace, coating, and wood paneling. Further, it provides adhesives for woodworking, building and construction, automotive, paper and packaging, hygiene and personal care, cigarette, mattress, and bookbinding. The company exports its products. Techbond Group Berhad was founded in 1992 and is headquartered in Shah Alam, Malaysia.

Exchange Ticker
KLS 5289.KL
Trades
Dividend Yield
6.03%
Annual Dividends
0.01MYR
Next Ex. Div Date
Dec. 5, 2025
Payout Ratio
29.76%
Dividend History paid per year (MYR)
Historical Dividends
Year Total Dividends
▸2026
0.01 MYR
Dec. 21, 2026 (estimated) 0.0100
▸2025
0.01 MYR
Dec. 24, 2025 0.0075
▸2024
0.02 MYR
Dec. 6, 2024 0.0100
July 3, 2024 0.0050
▸2023
0.01 MYR
Dec. 15, 2023 0.0075
Jan. 17, 2023 0.0050
▸2021
0.02 MYR
Sept. 30, 2021 0.0050
Jan. 18, 2021 0.0100
▸2020
0.00 MYR
Dec. 21, 2020 0.0044
▸2019
0.03 MYR
Oct. 10, 2019 0.0200
Sept. 20, 2019 0.0089
Upcoming Dividends
Name Payment Date Status Amount
Techbond Group Berhad Dec 24, 2025 0.0075 MYR
Stock Splits
Split Date Split Ratio to 1
March 25, 2021 2.25
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