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Shengyi Technology Co., Ltd. 600183.SS · Stock Open Shengyi Technology Co., Ltd. in new tab

143.93 CNY
P/E
67.92
EPS
2.15
Yield
0.82%
Safety Score
60
P/B
19.17
ROE
31.47
Beta
1.74
Target Price
188.57 CNY
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Key Metrics
Earnings dateOct. 23, 2026
P/E67.92
EPS2.15
Book Value7.62
Price to Book19.17
Debt/Equity30.11
% Insiders48.649%
Growth
Revenue Growth0.54%
Earnings Growth1.54%
Estimates
Forward P/E30.95
Forward EPS4.72
Target Mean Price188.57
Dividend
Dividend Yield0.82%
Annual dividends1.20 CNY
Ex-Div. DateJune 5, 2026
Payout39.20%
5y avg Yield2.36%

DCF Valuation

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Currency: CNY
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DCF Result

Fair Value (DCF)
Current Price
Upside
WACC
Terminal PV
Σ PV of FCFs
Note: historical bars show reported FCF (for context); forward bars show PV of projected FCF; if no per-year data, totals are shown.

Shengyi Technology Co., Ltd. Logo Shengyi Technology Co., Ltd. Analysis (600183.SS)

China Information Technology Official Website Stock

Is Shengyi Technology Co., Ltd. a good investment? Shengyi Technology Co., Ltd. (600183.SS) is currently trading at 143.93 CNY. Market analysts have a consensus price target of 188.57 CNY. This suggests a potential upside from current levels.

In terms of valuation, the stock trades at a P/E ratio of 67.92. This high multiple suggests investors have priced in significant future growth expectations.

Earnings Schedule: Shengyi Technology Co., Ltd. is expected to release its next earnings report on Oct. 23, 2026. The market consensus estimate for Forward EPS is 4.72.

For income investors, Shengyi Technology Co., Ltd. pays a dividend yield of 0.82%. With a payout ratio of 39%, the dividend appears sustainable.

Investor FAQ

Does Shengyi Technology Co., Ltd. pay a dividend?

Yes, it pays an annual dividend of 1.20 CNY (0.82% yield).

What asset class is Shengyi Technology Co., Ltd.?

Shengyi Technology Co., Ltd. is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be Oct. 23, 2026. The company currently has a trailing EPS of 2.15.

Company Profile

Shengyi Technology Co.,Ltd. engages in the design, production, and sales of copper clad laminates, bonding sheets, and printed circuit boards in China and internationally. The company offers flame-retardant epoxy glass fabric reinforced laminates, composite epoxy materials, and flexible circuit materials, as well as prereg for multilayer circuit boards; and smart and rigid materials, automotive and RF materials, IMS and HTC materials, IC substrate and flexible materials, HSD materials, and special materials. It also provides high-end electronic materials, such as prepregs, insulating laminates, metal-based copper clad foil laminates, resin-coated copper foil, and covering films. The company's products are primarily used in high computing power, AI servers, 5G antennas, base stations, computers, servers, the aerospace industry, chip packaging, automotive electronics, smart homes, industrial control medical equipment, home appliances, consumer terminals, and various electronic products. It also exports its products to America, Europe, Korea, Japan, and Southeast Asia. The company was formerly known as Guangdong Shengyi Sci. Tech Co., Ltd. Shengyi Technology Co.,Ltd. was founded in 1985 and is headquartered in Dongguan, China.

Exchange Ticker
SHH (China) 600183.SS
Trades
Dividend Yield
0.82%
5y avg 2.36%
Annual Dividends
1.20CNY
Next Ex. Div Date
June 5, 2026
Payout Ratio
39.20%
Dividend History paid per year (CNY)
Historical Dividends
Year Total Dividends
2027
0.80 CNY
June 3, 2027 (estimated) 0.8000
2026
1.20 CNY
Sept. 25, 2026 (estimated) 0.4000
June 5, 2026 0.8000
2025
1.00 CNY
Sept. 25, 2025 0.4000
May 23, 2025 0.6000
2024
0.45 CNY
May 24, 2024 0.4500
2023
0.45 CNY
May 26, 2023 0.4500
2022
0.60 CNY
May 26, 2022 0.6000
2021
0.40 CNY
May 28, 2021 0.4000
2020
0.40 CNY
May 29, 2020 0.4000
2019
0.35 CNY
June 6, 2019 0.3500
2018
0.31 CNY
May 28, 2018 0.3103
2017
0.33 CNY
June 12, 2017 0.3300
2016
0.30 CNY
June 2, 2016 0.3000
2015
0.25 CNY
May 28, 2015 0.2500
2014
0.40 CNY
May 19, 2014 0.4000
2013
0.15 CNY
Aug. 1, 2013 0.1500
2012
0.42 CNY
June 1, 2012 0.4160
2011
0.30 CNY
April 19, 2011 0.3000
2010
0.12 CNY
May 25, 2010 0.1200
2009
0.15 CNY
June 22, 2009 0.1500
2008
0.12 CNY
June 13, 2008 0.1200
2007
0.05 CNY
June 11, 2007 0.0531
2006
0.18 CNY
Sept. 25, 2006 0.0297
Sept. 25, 2006 0.0840
June 27, 2006 0.0637
2005
0.24 CNY
June 28, 2005 0.1900
June 28, 2005 0.0505
2004
0.15 CNY
June 15, 2004 0.1200
June 15, 2004 0.0319
2003
0.13 CNY
June 3, 2003 0.1000
June 3, 2003 0.0266
2002
0.12 CNY
July 12, 2002 0.0199
July 12, 2002 0.0975
2001
0.18 CNY
May 16, 2001 0.1500
May 16, 2001 0.0307
2000
0.14 CNY
April 28, 2000 0.1200
April 28, 2000 0.0164
1999
0.02 CNY
July 12, 1999 0.0188
Upcoming Dividends
Name Payment Date Status Amount
Shengyi Technology Co., Ltd. Jun 05, 2026 0.8 CNY
Shengyi Technology Co., Ltd. Sep 25, 2025 0.4 CNY
Stock Splits
Split Date Split Ratio to 1
April 28, 2000 1.5
July 12, 2002 1.3
Sept. 25, 2006 1.5
June 1, 2012 1.3
May 28, 2018 1.45
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