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BE Semiconductor Industries N.V. BESIY · Stock Open BE Semiconductor Industries N.V. in new tab

230.44 USD
P/E
104.27
EPS
2.21
Yield
1.08%
P/B
36.92
ROE
28.69
Beta
1.21
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Key Metrics
Earnings dateJuly 23, 2026
P/E104.27
EPS2.21
Book Value6.24
Price to Book36.92
Debt/Equity124.48
Growth
Revenue Growth0.08%
Earnings Growth-0.28%
Dividend
Dividend Yield1.08%
Annual dividends2.49 USD
Ex-Div. DateApril 28, 2026
Payout116.85%
5y avg Yield2.87%

DCF Valuation

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DCF Result

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BE Semiconductor Industries N.V. Logo BE Semiconductor Industries N.V. Analysis (BESIY)

Netherlands Information Technology Official Website Stock

Is BE Semiconductor Industries N.V. a good investment? BE Semiconductor Industries N.V. (BESIY) is currently trading at 230.44 USD.

In terms of valuation, the stock trades at a P/E ratio of 104.27. This high multiple suggests investors have priced in significant future growth expectations.

Earnings Schedule: BE Semiconductor Industries N.V. is expected to release its next earnings report on July 23, 2026.

For income investors, BE Semiconductor Industries N.V. pays a dividend yield of 1.08%. With a payout ratio of 117%, the dividend appears to be under pressure.

Investor FAQ

Does BE Semiconductor Industries N.V. pay a dividend?

Yes, it pays an annual dividend of 2.49 USD (1.08% yield).

What asset class is BE Semiconductor Industries N.V.?

BE Semiconductor Industries N.V. is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be July 23, 2026. The company currently has a trailing EPS of 2.21.

Company Profile

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die bonding, die lid attach, and fan out wafer level packaging; packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment comprising tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's brand names include Datacon, Esec, Fico, and Meco. It serves multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Exchange Ticker
PNK (United States) BESIY
Trades
Dividend Yield
1.08%
5y avg 2.87%
Annual Dividends
2.49USD
Next Ex. Div Date
April 28, 2026
Payout Ratio
116.85%
Dividend History paid per year (USD)
Historical Dividends
Year Total Dividends
2027
2.05 USD
May 10, 2027 (estimated) 2.0517
2026
1.59 USD
May 14, 2026 1.5858
2025
2.49 USD
May 5, 2025 2.4885
2024
2.30 USD
May 6, 2024 2.3048
2023
3.13 USD
May 5, 2023 3.1256
2022
3.51 USD
May 9, 2022 3.5098
2021
2.05 USD
May 10, 2021 2.0539
2020
1.12 USD
May 11, 2020 1.1172
2019
1.87 USD
May 7, 2019 1.8691
2018
5.65 USD
May 8, 2018 5.6538
2017
1.90 USD
May 11, 2017 1.8951
2016
1.37 USD
May 17, 2016 1.3682
2015
1.68 USD
May 15, 2015 1.6802
2014
0.46 USD
May 16, 2014 0.4576
2013
0.39 USD
May 10, 2013 0.3900
2012
0.28 USD
June 4, 2012 0.2785
2011
0.28 USD
July 6, 2011 0.2846
Upcoming Dividends
Name Payment Date Status Amount
BE Semiconductor Industries N.V. May 14, 2026 1.58581 USD
Stock Splits
Split Date Split Ratio to 1
May 10, 2018 2.000000
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