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201.00 USD
P/E
75.09
EPS
2.86
Yield
0.84%
Safety Score
82
P/B
26.70
ROE
44.87
Beta
1.30
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Key Metrics
Earnings dateOct. 22, 2026
P/E75.09
EPS2.86
Book Value8.04
Price to Book26.70
Debt/Equity62.45
Growth
Revenue Growth0.69%
Earnings Growth1.78%
Dividend
Dividend Yield0.84%
Annual dividends1.58 USD
Ex-Div. DateApril 28, 2026
Payout60.08%
5y avg Yield2.87%

DCF valuation

Model fair value for BE Semiconductor Industries N.V. (BESIY)
Result
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Assumptions
Growth– Capex– Tax– Terminal g– Cost of equity– Cost of debt–

BE Semiconductor Industries N.V. Logo BE Semiconductor Industries N.V. Analysis (BESIY)

Netherlands Information Technology Official Website Stock

Is BE Semiconductor Industries N.V. a good investment? BE Semiconductor Industries N.V. (BESIY) is currently trading at 201.00 USD.

In terms of valuation, the stock trades at a P/E ratio of 75.09. This high multiple suggests investors have priced in significant future growth expectations.

Earnings Schedule: BE Semiconductor Industries N.V. is expected to release its next earnings report on Oct. 22, 2026.

For income investors, BE Semiconductor Industries N.V. pays a dividend yield of 0.84%. With a payout ratio of 60%, the dividend appears sustainable.

Investor FAQ

Does BE Semiconductor Industries N.V. pay a dividend?

Yes, it pays an annual dividend of 1.58 USD (0.84% yield).

What asset class is BE Semiconductor Industries N.V.?

BE Semiconductor Industries N.V. is classified as a Stock. You can compare it against its peer in the "Related Symbols" list.

When is the next earnings date?

The next earnings date is projected to be Oct. 22, 2026. The company currently has a trailing EPS of 2.86.

Company Profile

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Exchange Ticker
PNK (United States) BESIY
Trades
Dividend Yield
0.84%
5y avg 2.87%
Annual Dividends
1.58USD
Next Ex. Div Date
April 28, 2026
Payout Ratio
60.08%
Dividend History paid per year (USD)
Historical Dividends
Year Total Dividends
▸2027
2.39 USD
May 5, 2027 (estimated) 2.3905
▸2026
1.85 USD
May 14, 2026 1.8477
▸2025
2.49 USD
May 5, 2025 2.4885
▸2024
2.30 USD
May 6, 2024 2.3048
▸2023
3.13 USD
May 5, 2023 3.1256
▸2022
3.51 USD
May 9, 2022 3.5098
▸2021
2.05 USD
May 10, 2021 2.0539
▸2020
1.12 USD
May 11, 2020 1.1172
▸2019
1.87 USD
May 7, 2019 1.8691
▸2018
5.65 USD
May 8, 2018 5.6538
▸2017
1.90 USD
May 11, 2017 1.8951
▸2016
1.37 USD
May 17, 2016 1.3682
▸2015
1.68 USD
May 15, 2015 1.6802
▸2014
0.46 USD
May 16, 2014 0.4576
▸2013
0.39 USD
May 10, 2013 0.3900
▸2012
0.28 USD
June 4, 2012 0.2785
▸2011
0.28 USD
July 6, 2011 0.2846
Upcoming Dividends
Name Payment Date Status Amount
BE Semiconductor Industries N.V. May 14, 2026 1.84765 USD
Stock Splits
Split Date Split Ratio to 1
May 10, 2018 2:1
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