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Micro-Mechanics (Holdings) Ltd. SG1O09910991 · Stock Open Micro-Mechanics (Holdings) Ltd. in new tab

2.52 SGD
P/E
22.45
EPS
0.11
Yield
2.33%
P/B
5.98
ROE
29.83
Beta
0.29
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Key Metrics
P/E22.45
EPS0.11
Book Value0.41
Price to Book5.98
Debt/Equity4.45
% Insiders61.146%
Growth
Revenue Growth0.29%
Earnings Growth0.66%
Estimates
Forward P/E20.58
Forward EPS0.12
Dividend
Dividend Yield2.33%
Annual dividends0.06 SGD
Ex-Div. DateFeb. 5, 2026
Payout52.45%
5y avg Yield3.68%

DCF valuation

Model fair value for Micro-Mechanics (Holdings) Ltd. (SG1O09910991)
Result
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Assumptions
Growth– Capex– Tax– Terminal g– Cost of equity– Cost of debt–

Micro-Mechanics (Holdings) Ltd. Logo Micro-Mechanics (Holdings) Ltd. Analysis (SG1O09910991)

Singapore Technology Official Website Stock

Is Micro-Mechanics (Holdings) Ltd. a good investment? Micro-Mechanics (Holdings) Ltd. (SG1O09910991) is currently trading at 2.52 SGD.

In terms of valuation, the stock trades at a P/E ratio of 22.45. This valuation is generally in line with the broader market.

For income investors, Micro-Mechanics (Holdings) Ltd. pays a dividend yield of 2.33%. With a payout ratio of 52%, the dividend appears sustainable.

Investor FAQ

Does Micro-Mechanics (Holdings) Ltd. pay a dividend?

Yes, it pays an annual dividend of 0.06 SGD (2.33% yield).

What asset class is Micro-Mechanics (Holdings) Ltd.?

Micro-Mechanics (Holdings) Ltd. is classified as a Stock. You can compare it against 3 other assets in the "Related Symbols" list on this page.

Company Profile

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets precision components for the wafer-fabrication equipment and other industries. The company offers die attach-pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide die collets, sensor assemblies, and vacuum wand tools; die attach-dispensing products, including dispensing nozzle adaptors, dispense nozzles, pen dispensing assemblies, writing pen nozzle tips, and epoxy stamping tools; and die attach-die ejection products comprising ejector needles, needle holders/pepper pots, and needle holder seals. It also provides wire bonding products consisting of thermosonic bonding products, which include clamps and electronic flame off products; and ultrasonic bonding products, such as clamps, bearing base assemblies, anvils, and wire cutters. In addition, the company offers encapsulation products, including BGA dispensing nozzles, dispensing manifolds, pump screws, and O-rings, as well as engages in the contract manufacturing services. It operates in Singapore, Malaysia, the Philippines, the United States, China, Thailand, Taiwan, Europe, Japan, and internationally. The company was founded in 1983 and is headquartered in Singapore.

Exchange Ticker
SG1O09910991
PNK (United States) MCRNF
SES 5DD.SI
Trades
Dividend Yield
2.33%
5y avg 3.68%
Annual Dividends
0.06SGD
Next Ex. Div Date
Feb. 5, 2026
Payout Ratio
52.45%
Dividend History paid per year (SGD)
Historical Dividends
Year Total Dividends
▸2027
0.03 SGD
Feb. 5, 2027 (estimated) 0.0278
▸2026
0.06 SGD
Nov. 3, 2026 (estimated) 0.0314
Feb. 5, 2026 0.0300
▸2025
0.06 SGD
Nov. 6, 2025 0.0300
Feb. 6, 2025 0.0300
▸2024
0.06 SGD
Nov. 7, 2024 0.0300
Feb. 5, 2024 0.0300
▸2023
0.09 SGD
Nov. 3, 2023 0.0300
Feb. 6, 2023 0.0600
▸2022
0.14 SGD
Nov. 4, 2022 0.0800
Feb. 9, 2022 0.0600
▸2021
0.14 SGD
Nov. 8, 2021 0.0800
Feb. 15, 2021 0.0600
▸2020
0.12 SGD
Nov. 5, 2020 0.0700
Feb. 18, 2020 0.0500
▸2019
0.10 SGD
Nov. 6, 2019 0.0600
Feb. 4, 2019 0.0400
▸2018
0.10 SGD
Nov. 2, 2018 0.0600
Feb. 1, 2018 0.0400
▸2017
0.08 SGD
Nov. 3, 2017 0.0500
Feb. 13, 2017 0.0300
▸2016
0.06 SGD
Nov. 4, 2016 0.0400
Feb. 5, 2016 0.0200
▸2015
0.05 SGD
Nov. 3, 2015 0.0300
Feb. 5, 2015 0.0200
▸2014
0.03 SGD
Nov. 3, 2014 0.0200
Jan. 30, 2014 0.0100
▸2013
0.03 SGD
Nov. 1, 2013 0.0200
Jan. 31, 2013 0.0100
▸2012
0.03 SGD
Nov. 6, 2012 0.0200
Feb. 3, 2012 0.0100
▸2011
0.03 SGD
Nov. 3, 2011 0.0200
Feb. 15, 2011 0.0100
▸2010
0.03 SGD
Nov. 1, 2010 0.0200
Feb. 11, 2010 0.0100
▸2009
0.02 SGD
Nov. 5, 2009 0.0100
Feb. 12, 2009 0.0100
▸2008
0.05 SGD
Nov. 6, 2008 0.0300
Feb. 14, 2008 0.0200
▸2007
0.05 SGD
Oct. 15, 2007 0.0350
Feb. 23, 2007 0.0150
▸2006
0.04 SGD
Oct. 27, 2006 0.0250
Feb. 23, 2006 0.0100
▸2005
0.02 SGD
Oct. 20, 2005 0.0160
Feb. 18, 2005 0.0080
▸2004
0.01 SGD
Oct. 28, 2004 0.0120
▸2003
0.01 SGD
Nov. 27, 2003 0.0080
Upcoming Dividends
Name Payment Date Status Amount
Micro-Mechanics (Holdings) Ltd. Feb 05, 2026 0.03 SGD
Micro-Mechanics (Holdings) Ltd. Nov 06, 2025 0.03 SGD
Stock Splits
Split Date Split Ratio to 1
Nov. 4, 2005 1.25
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